C-SAM is the use of ultrasonic pulse detection instrument sample of internal voids and other defects, mainly used to observe the internal components of the chip bonding failure, delamination, cracks, inclusions, voids and the like. Scan Mode? Transmission time measurement mode (A-Scan)? Surface and a transverse section of the scan mode (C-Scan)? Longitudinal sectional imaging modalities (B-Scan)? Transmission scan (T-Scan, limit 15MHz / 30MHz probe)